MX 102-8
High-resolution thickness and flatness (TTV) gauge for 150–200 mm silicon wafers
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MX 102-6
High-resolution thickness and flatness (TTV) gauge for 100–150 mm silicon wafers.
Easy adaption to different thickness ranges within a few seconds. Integration into automatic robotic sorter systems possible. The MX102-6 is ideally suited for research & development, qualification of processes, and process control of thickness and flatness (TTV). A pair of capacitive sensors samples four radial profiles (45 degrees) on every wafer. One such profile consists of 200 local thickness values and is offset by 45 degrees relative to the neighbouring profile. Comes with our powerful MX-NT operating software.
Measurement types
Features
| Wafer Diameter | 100 mm, 125 mm, 150 mm |
| Thickness accurancy | ±0.4 µm |
| Resolution | 10 nm |
| Spatial resolution | 1 mm |
| Scans | 4 |
| Software | MX-NT |
Product comparison
| Feature |
MX 102-6
|
MX 102-8
|
MX 1012
|
MX 1018
|
|---|---|---|---|---|
| Wafer Diameter | 100 mm, 125 mm, 150 mm | 150 mm, 200 mm | 200 mm, 300 mm | 450 mm |
| Software | MX-NT | MX-NT | MX-NT | MX-NT |
| Scans | 4 | 4 | up to 8 | up to 8 |
| Spatial resolution | 1 mm | 1 mm | 1 mm | 1 mm |
| Resolution | 10 nm | 10 nm | 10 nm | 10 nm |
| Thickness accurancy | ±0.4 µm | ±0.4 µm | ±0.4 µm | ±0.3 µm |
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