MX 301-8
Easy one-point thickness gauge for 30–200 mm silicon wafers.
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MX 3012
Easy one-point thickness gauge for 75–300 mm silicon wafers.
The MX3012 is a robust and stable instrument for quick and simple manual thickness gauge of a large variety of silicon wafers. Adaptable to different thickness ranges within a few seconds. With an easy one-click calibration. Connected to a PC, which allows collecting data of multiple measurements, calculating flatness (TTV), mean value or standard deviation of single wafers or of complete wafer lots.
Measurement types
Features
| Wafer Diameter | up to 300 mm |
| Thickness accurancy | ±0.5 µm |
| Resolution | 10 nm |
| Thickness range | default 200–1000 µm |
| Software | MX-NT |
| Dynamic range | 800 µm |
| Switchable to measure high-res material | yes |
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