MX 301-AC

Easy one-point thickness gauge for 30–200 mm semiconducting and metallic materials.

The MX301-AC is a robust and stable instrument for quick and simple manual thickness gauge. Made for a large variety of silicon and solar wafers and pieces of semiconducting or metallic materials. Fully self-calibrating without the need for gauge blocks nor reference wafers. Connected to a PC, which allows collecting data of multiple measurements, calculating flatness (TTV), mean value or standard deviation of single wafers or of complete wafer lots.


Measurement types

Thickness Flatness (TTV)

Features

Wafer Diameter up to 200 mm
Thickness accurancy ±0.5 µm
Resolution 10 nm
Thickness range default 200–1000 µm
Software MX-NT
Dynamic range 800 µm

WHICH TOOL
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Peter Michel

+49 (0)721 83118-17
sales(at)eh-metrology.com

 

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