MX 204-8-21-V
Automatable geometry gauge for thin 150 mm and 200 mm silicon wafers.
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MX 204-8-21-TKO2
Automatable geometry gauge for thin 150 mm and 200 mm Taiko silicon wafers.
The MX204-8-21-TKO2 works as manually loaded stand-alone tool as well as fully integrated in automated robot systems. Especially for Taiko wafers, with or without protective tape. With its 21 sensor pairs it controls thickness, bow and warp after back side grinding. Throughput at least 80 wafers per hour. Different wafer sizes can be used without changeover thanks to the upstream centering station. Comes with our powerful MX-NT operating software.
Measurement types
Features
| Wafer Diameter | 150 mm, 200 mm |
| Thickness accurancy | ±1 µm |
| Resolution | 0.1 µm |
| Thickness range | 50–500 µm (TAIKO ring up to 750 µm) |
| Automatic | yes |
| Software | MX-NT |
| Warp characteristics | Sori |
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