MX 6012
Combined thickness and resistivity gauge for 200 mm and 300 mm silicon wafers.
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MX 608
Combined thickness and resistivity gauge for 150 mm and 200 mm silicon wafers.
The MX608 is designed to characterize silicon wafers. It combines contactless thickness, resistivity and P/N dotation sensors. Automatic move-in and turn of the wafer allows up to 18 scans of each wafer. To be connected to a PC. Comes with our powerful MX-NT operating software. Integration into automatic robotic sorter systems possible.
Measurement types
Features
| Wafer Diameter | 150 mm, 200 mm |
| Software | MX-NT |
| Thickness | 500–800 μm |
| Max. warp | 100 μm |
| Resistivity | 0.001 – 200 Ohm·cm |
| Type check | 0.020–200 Ohm·cm |
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