MX 203-8-37-B
Fast contactless geometry gauge for thin 150 mm and 200 mm silicon wafers.
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MX 203-58-37-B
Fast contactless geometry gauge for thin 125–200 mm silicon wafers.
High throughput: the MX203-58-37-B gauges with its 37 sensor pairs every wafer within max. 8 seconds. It controls thickness, bow and warp after back side grinding. Flexible wafer size adjustment by various centering-frames. Comes with our powerful MX-NT operating software.
Measurement types
Features
| Wafer Diameter | 125 mm, 150 mm, 200 mm |
| Thickness accurancy | ±2.0 µm |
| Resolution | 75nm |
| Thickness range | 200–800 µm |
| Automatic | no |
| Software | MX-NT |
| Warp characteristics | Sori |
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