Automatable bow and warp gauge for 450 mm silicon wafers.
The MX2018-W manages the difficult 450mm size wafers. Upright position measuring avoids the otherwise enormous gravity-induced sag. With its 73 sensor pairs it controls center thickness, bow and warp in high resolution. For covering all geometry properties we recommend using MX2018-W in combination with MX1018. Within a robot sorter these both modules can measure two wafers simultaneously without detraction of the throughput. Comes with our powerful MX-NT operating software.
| Wafer Diameter | 300 mm, 450 mm |
| Automatic | yes |
| Software | MX-NT |
| Warp characteristics | Sori |
| Warp accurancy | ±5 µm + 5% of reading |
| Warp precision | ±0.5 µm + 1% of reading |
| Warp range | 800 µm |
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