MX 7012
High resolution thickness and surface profiler for etched 300 mm silicon wafers
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MX 302
Contactless wafer thickness profile measuring instrument for 150 mm and 200 mm silicon wafers.
The MX 302 measures a high resolution thickness scan. Prepared for integration into an automated etching system. Automatic measuring of wafers in the carrier.
Measurement types
Features
| Wafer Diameter | 150 mm, 200 mm |
| Thickness accurancy | ±0.5 µm |
| Resolution | 0.1 µm |
| Thickness range | up to 3 |
| Software | VirtualDevice |
| Dynamic range | customized |
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