MX 204-8-21-V
Automatable geometry gauge for thin 150 mm and 200 mm silicon wafers.
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MX 204-6-13-V
Automatable geometry gauge for thin 100–150 mm silicon wafers.
The MX204-6-13-V works as manually loaded stand-alone tool as well as fully integrated in automated robot systems. With its 13 sensor pairs it controls thickness, bow and warp after back side grinding. Throughput at least 80 wafers per hour. Different wafer sizes can be used without changeover thanks to the upstream centering station. Comes with our powerful MX-NT operating software.
Measurement types
Features
| Wafer Diameter | 125 mm, 150 mm (100 mm is optional) |
| Thickness accurancy | ±1 µm |
| Resolution | 0.1 µm |
| Thickness range | 100–700 µm |
| Automatic | yes |
| Software | MX-NT |
| Warp characteristics | Sori |
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