MX 3014

Easy one-point thickness gauge for thin, framed 200 mm and 300 mm silicon wafers.

The MX3014 is a robust and stable instrument for quick and simple manual thickness gauge. Especially for thin wafers, unframed and framed with dicing tape or backgrind tape. Simple handling without the tape thickness nor the tape's dielectric constant. Light barriers avoid mismeasurement at the edges. Fully self-calibrating without the need for gauge blocks nor reference wafers. Connected to a PC, which allows collecting data of multiple measurements, calculating flatness (TTV), mean value or standard deviation of single wafers or of complete wafer lots.