MX 6012
Combined thickness and resistivity gauge for 200 mm and 300 mm silicon wafers.
Fast sheet resistance gauge for 50–200 mm silicon wafers and conductive films.
The MX604-S gauges sheet resistance of semiconducting wafers and conductive films on high-ohm substrates with the reliable eddy current method. Fully self-calibrating, thus temperature and humidity changes are negligible. Integrated alphanumeric display. Workes as stand-alone or connected to a PC via serial interface, which allows collecting data of multiple measurements, mean value or standard deviation of single wafers or of complete wafer lots.
| Wafer Diameter | 2" to 200 mm |
| Thickness accurancy | ±3 µm |
| Software | EHMaster |
| Measuring time | 0.3 s |
| Thickness | max. 1000 μm |
| Sensor diameter | 20 mm |
| Active area | ca. 12mm |
| Distance from edge | min. 10 mm |
| Gap between sensor and table | 1400 μm |
| Measuring table | 300 x 300 mm |
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