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Detail of MX3014-Z Measurement Tool for wafer thickness by E+H Metrology
Detail of MX3014-Z Measurement Tool for wafer thickness by E+H Metrology

MX 3014-Z

OEM integrated thickness gauge for 100–200 mm silicon and insulating wafers.

The MX3014-Z is an in-line module for belt or robot transported wafers. It gauges thickness on the fly between automated manufacturing processes. Completely self-calibrating for effortless usage.

Measurement types

Thickness

Features

Wafer Diameter 100–200 mm
Thickness accurancy ±1 µm
Resolution 0.1 µm
Thickness range 200–800 µm
Software EHMaster

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Portrait of Peter Michel, Product Sales Manager of E+H Metrology

Peter Michel

+49 (0)721 83118-17
sales(at)eh-metrology.com

 

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