MX 7012

High resolution thickness and surface profiler for etched 300 mm silicon wafers

The MX7012 is designed to control thickness, flatness (TTV), warp, waviness and optional saw marks after wire sawing. Capacitive sensors scan a diagonal cut through the center of the wafer. On the sides where the saw wire enters and exits, thickness and saw marks are measured simultaneously. (The latter with an opto-electronic measuring system.) Available as in-line integrated module or as hand-loaded stand-alone for spot checks. Comes with our powerful MX-NT operating software.