FLEXIBLE WAFER MEASUREMENT
for wide-range requirements

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The MX base series are manual tools for lots of wafer gauge needs. In addition, they can be adapted to your specific needs.

Technical tool specifications can be modified (in accordance with the physical limits). Some of them can be used as modules on E+H automatic robot tools as well.

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Manual Tools

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Wafer Size

Characteristics

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MX 1012

High-resolution thickness and flatness (TTV) gauge for 200–300mm silicon wafers.

MX 102-6

High-resolution thickness and flatness (TTV) gauge for 100–150mm silicon wafers.

MX 2012-H

fast chip production geometry gauge for 300mm silicon wafers.

MX 203-4-21

Fast contactless geometry gauge for 2–4" silicon wafers.

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